A vehicle’s thermal management system regulates temperature and ensures optimal operation of both the powertrain and cabin. Key components include:
A thermal management system typically consists of an MCU (microcontroller), pump or valve drivers, compressor, fan drivers, and temperature sensors, coordinating to maintain efficient thermal control.
AutoChips AC7840x for Thermal Management Systems
Key Features
ARM Cortex-M4F MCU (AEC-Q100 Grade 1, ISO 26262 ASIL-B)
AUTOSAR V4.4 support
Rich interfaces: CAN FD/LIN/SPI/I2C/ADC/PWM
Applications
HVAC Control
Compressor/PTC/heat pump regulation
Sensor data processing (temp/pressure)
Battery Thermal Management
Maintains 20-35℃ optimal range
Activates cooling/heating when needed
System Integration
Enables coordinated control across:
Traditional engine cooling
EV-specific components (OBC/DCDC/PTC)

SIT1044QT/SIT1021QT, supporting CAN FD or LIN communication protocols for information transfer between modules.

PMIC/SBC: HE35584/35585, provides stable power supply to system components and ensures functional safety (ASIL-D).
Multi-channel Half-Bridge Driver: HE99MD9008, suitable for controlling low-power brushed motors.


SiC and IGBTs, used in EV air conditioning compressor controllers, increase inverter switching frequency, reduce harmonic loss, and improve compressor and heat pump system efficiency.
More Solutions:
As automotive thermal management technology evolves, new chips will be integrated to meet higher performance and functional requirements. The types of chips used may vary depending on the automaker, vehicle model, and specific thermal management system design. We also recommend the following additional chip solutions.

Flagchips FC4150 Thermal Management Solution
Key specifications: 3 x 20kHz FOC control, MCU load under 62%
Multiple high-speed ADCs for current and voltage signal acquisition
8 FTUs with dead-zone center-aligned PWM, supporting reload and match events for ADC sampling
150MHz core frequency, delivering up to 400 DMIPS
Built-in FPU co-processor for motor algorithm acceleration
LQFP64/100/144/176 package options, with 512KB/1MB/2MB Flash choices
Functional safety ASIL-B, with MCAL + functional safety SDK software package
SPINTROL Integrated LDO+LIN+Pre-driver Smart SoC.
High Performance
ARM Cortex-M4F core, up to 100MHz
128KB Flash, 32KB SRAM, 1KB EEPROM
High Integration
13-bit high-speed SAR ADC
2 PGAs, 2 analog comparators
3 phase comparators, BEMF voltage divider
Current-mode pre-driver (excellent EMC)
Multiple LDOs, LIN transceiver
CAN and CAN-FD interfaces
High Reliability
ECC protection for all memory
Dedicated ADC for voltage monitoring
VDS overcurrent monitoring for MOSFETs
High-side E-fuse (reverse polarity protection)
Open/short circuit detection, backup clock
Watchdog interrupt (or reset)