Solution for Automotive Thermal Management Systems
Vehicle thermal management regulates critical component temperatures, ensuring performance, reliability and comfort. Core functions include:
Engine cooling
Cabin HVAC
Battery thermal control
Transmission cooling


A vehicle’s thermal management system regulates temperature and ensures optimal operation of both the powertrain and cabin. Key components include:


  • Coolant Circulation System: Comprising water pumps, radiators, and thermostats, it removes heat through the flow of coolant.
  • Air Conditioning System: Includes compressors, condensers, and evaporators to provide cabin cooling and heating.
  • Fans and Ventilation: Enhance airflow and improve heat dissipation.
  • Temperature Sensors and Controllers: Monitor component temperatures in real time and control the system based on predefined strategies.

A thermal management system typically consists of an MCU (microcontroller), pump or valve drivers, compressor, fan drivers, and temperature sensors, coordinating to maintain efficient thermal control.


AutoChips AC7840x for Thermal Management Systems

Key Features

ARM Cortex-M4F MCU (AEC-Q100 Grade 1, ISO 26262 ASIL-B)

AUTOSAR V4.4 support

Rich interfaces: CAN FD/LIN/SPI/I2C/ADC/PWM

Applications

HVAC Control

Compressor/PTC/heat pump regulation

Sensor data processing (temp/pressure)

Battery Thermal Management

Maintains 20-35℃ optimal range

Activates cooling/heating when needed

System Integration
Enables coordinated control across:

Traditional engine cooling

EV-specific components (OBC/DCDC/PTC)





      








PMIC/SBC: HE35584/35585, provides stable power supply to system components and ensures functional safety (ASIL-D).

Multi-channel Half-Bridge Driver: HE99MD9008, suitable for controlling low-power brushed motors.







SiC and IGBTs, used in EV air conditioning compressor controllers, increase inverter switching frequency, reduce harmonic loss, and improve compressor and heat pump system efficiency.


More Solutions:

As automotive thermal management technology evolves, new chips will be integrated to meet higher performance and functional requirements. The types of chips used may vary depending on the automaker, vehicle model, and specific thermal management system design. We also recommend the following additional chip solutions.





Flagchips FC4150 Thermal Management Solution
Key specifications: 3 x 20kHz FOC control, MCU load under 62%
Multiple high-speed ADCs for current and voltage signal acquisition
8 FTUs with dead-zone center-aligned PWM, supporting reload and match events for ADC sampling
150MHz core frequency, delivering up to 400 DMIPS
Built-in FPU co-processor for motor algorithm acceleration
LQFP64/100/144/176 package options, with 512KB/1MB/2MB Flash choices
Functional safety ASIL-B, with MCAL + functional safety SDK software package


SPINTROL Integrated LDO+LIN+Pre-driver Smart SoC.
High Performance
ARM Cortex-M4F core, up to 100MHz
128KB Flash, 32KB SRAM, 1KB EEPROM
High Integration
13-bit high-speed SAR ADC
2 PGAs, 2 analog comparators
3 phase comparators, BEMF voltage divider
Current-mode pre-driver (excellent EMC)
Multiple LDOs, LIN transceiver
CAN and CAN-FD interfaces
High Reliability
ECC protection for all memory
Dedicated ADC for voltage monitoring
VDS overcurrent monitoring for MOSFETs
High-side E-fuse (reverse polarity protection)
Open/short circuit detection, backup clock
Watchdog interrupt (or reset)